Additional technology options are available:
Here you can find General MPW and mini@sic run schedules and pricelists for 2022.
To reserve your seat on a run, please register your design in the Registration Form or contact the EUROPRACTICE partner responsible for the technology.
There are two prices in the EUROPRACTICE lists: Discounted and Standard.
Three conditions should be met for Discounted prices:
Standard prices apply to all other customers.
GLOBALFOUNDRIES MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBALFOUNDRIES SiGe 8XP | 21 | 23 | 22 | 21 | |||||||||
GLOBALFOUNDRIES 130nm BCDlite – Gen2 | 21 | 29 | |||||||||||
GLOBALFOUNDRIES 55 nm LPe-RF | 20 | ||||||||||||
GLOBALFOUNDRIES 45RFSOI | 3 | 16 | 19 | ||||||||||
GLOBALFOUNDRIES 45nm SPCLO – Silicon Photonics | 14 | 13 | 12 | 12 | |||||||||
GLOBALFOUNDRIES 28 nm SLPe | 9 | 8 | |||||||||||
GLOBALFOUNDRIES 22 nm FDSOI | 10 | 7 | 2 | 4 | 5 | 1 | |||||||
GLOBALFOUNDRIES 12 nm LP+ | 10 | 11 | 11 | 26 |
Important notes: Dates are Registration deadlines after which designs cannot be accepted.
Final GDSII file must be submitted within 6 weeks after this date.
Dates in red are preliminary.
A cancellation fee is applicable if the registration is cancelled later than 2 weeks after the Registration deadline or if the customer is unable to provide a DRC-clean GDS before the Tapeout deadline.
GLOBALFOUNDRIES MPW Pricelist | Standard EUR / mm² | Discounted EUR / mm² | |
---|---|---|---|
GLOBALFOUNDRIES SiGe 8XP | 4,200 | 4,000 | |
GLOBALFOUNDRIES 130 nm BCDlite | 1,650 | 1,500 | |
GLOBALFOUNDRIES 55 nm LPe-RF | 4,200
| 4,000 | |
GLOBALFOUNDRIES 45RFSOI | 7,350 | 7,000 | |
GLOBALFOUNDRIES 45nm SPCLO -Silicon Photonics (price per fixed block 5mm x 5mm)
| 210,000 | 200,000 | |
GLOBALFOUNDRIES 28 nm SLPe | 10,700 | 10,200 | |
GLOBALFOUNDRIES 22 nm FDSOI | 14,000 | 13,200 | |
GLOBALFOUNDRIES 12 nm LP+ | 26,000 | 25,000 |
Important notes:
Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 9mm2. Any edge length between 1.0mm to 11mm is possible.
The mentioned die size is referred to the Pre-Shrink die size.
GLOBALFOUNDRIES mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBALFOUNDRIES SiGe 8XP | 23 | 22 | 21 | ||||||||||
GLOBALFOUNDRIES 130nm BCDlite – Gen2 | 21 | 29 | |||||||||||
GLOBALFOUNDRIES 55 nm LPe-RF | 20 | ||||||||||||
GLOBALFOUNDRIES 45RFSOI | 16 | 19 | |||||||||||
GLOBALFOUNDRIES 45nm SPCLO – Silicon Photonics | 12 | 12 | |||||||||||
GLOBALFOUNDRIES 28 nm SLPe | 8 | ||||||||||||
GLOBALFOUNDRIES 22 nm FDSOI | 10 | 7 | 2 | 4 | 5 | 1 | |||||||
GLOBALFOUNDRIES 12 nm LP+ | 11 | 11 | 26 |
Important notes: The mini@sic model of GLOBALFOUNDRIES is available only for Universities and Research Institutions.
Dates are Registration deadlines after which designs cannot be accepted.
Final GDSII file must be submitted within 6 weeks after this date.
Dates in red are preliminary.
A cancellation fee is applicable if the registration is cancelled later than 2 weeks after the Registration deadline or if the customer is unable to provide a DRC-clean GDS before the Tapeout deadline.
GLOBALFOUNDRIES mini@sic Pricelist | Standard EUR / mm 2 | Discounted EUR / mm 2 | |
---|---|---|---|
GLOBALFOUNDRIES SiGe 8XP
| 6720 1,4
| 6,000 1
| |
GLOBALFOUNDRIES 130nm BCDlite – Gen2
| 2,550 2,4
| 2,250 2
| |
GLOBALFOUNDRIES 55 nm LPe-RF
| 6,100 1,4
| 5,600 1
| |
GLOBALFOUNDRIES 45RFSOI
| 10,650 1,4
| 9,800 1
| |
GLOBALFOUNDRIES 45nm SPCLO -Silicon Photonics
| 134,000 3,4
| 122,750 3
| |
GLOBALFOUNDRIES 28 nm SLPe
| 15,000 1,4
| 13,250 1
| |
GLOBALFOUNDRIES 22 nm FDSOI
| 19,600 1,4
| 17,150 1
| |
GLOBALFOUNDRIES 12 nm LP+
| 33,800 1,4
| 31,750 1
|
Important notes:
1 Price = area (mm²) * price/mm² with min. fabrication cost equivalent to 1 mm².
Any edge length between 1.0 mm to 11 mm is possible. The mentioned die size is referred to the Pre-Shrink die size.
2 Price = area (mm²) * price/mm² with min. fabrication cost equivalent to 2.5 mm².
Any edge length between 1.0 mm to 11 mm is possible. The mentioned die size is referred to the Pre-Shrink die size.
3 Price = fixed block size of 5mm x 2.455mm or 2.455mm x 5mm.
4 Prices applicable only for Universities and Research Institutes.
TSMC MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TSMC 0.18µm CMOS Logic or Mixed-Signal/RF, General Purpose | 5 | 23 | 30 | 6 13 27 | 1 8 | ||||||||
TSMC 0.18µm CMOS High Voltage BCD Gen 2 | 5 | 2 | 27 | 4 | 1 8 | ||||||||
TSMC 0.13µm CMOS Logic or MS/RF, GP or LP (8-inch) | 9 | 4 | |||||||||||
TSMC 0.13µm CMOS Logic or MS/RF, GP or LP (12-inch) | 5 | 9 | 30 | 8 | |||||||||
TSMC 90nm CMOS Logic or MS/RF, GP or LP | 9 | 11 | |||||||||||
TSMC 65nm CMOS Logic or MS/RF, GP or LP | 2 | 13 | 1 | ||||||||||
TSMC 40nm CMOS Logic or MS/RF, GP or LP (no triple gate oxide) | 2 23 | 30 | 8 | ||||||||||
TSMC 28nm CMOS Logic or RF HPC/HPC+ | 23 | 27 | |||||||||||
TSMC 16nm CMOS Logic or RF FinFET Compact | 2 | 6 | 25 |
Important notes:
Dates are GDS submission deadlines. Design registration must be done at least 3 months in advance.
Bumping is available upon request for all 12-inch technologies.
Contact eptsmc@imec.be if any of the following options are used: Bumping, MTP/OTP, Deep Trench, High Linearity MiM, Schottky Barrier Diode, ULL N/PMOS.
Prices for all TSMC technologies can be calculated through the online Price Request Form.
When 4 or more independent sub-designs are registered in one MPW submission to optimise the minimum charged area, an additional verification charge of 1,000 USD is applicable. This is regardless of the request and charges for sub die sawing (5 USD per additional die obtained from the base MPW submission).
TSMC mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TSMC 0.18µm CMOS General Mixed-Signal/RF | 23 * | 18 | |||||||||||
TSMC 0.18µm CMOS High Voltage BCD Gen 2 | 6 | ||||||||||||
TSMC 65nm CMOS Low Power MS/RF | 2 | 20 | |||||||||||
TSMC 40nm CMOS Low Power MS/RF | 27 | ||||||||||||
TSMC 28nm CMOS RF HPC+ | 2 | 25 |
Important notes:
Dates are GDS submission deadlines. Design registration must be done at least 3 months in advance.
Bumping is available upon request for all 12-inch technologies.
Contact eptsmc@imec.be if any of the following options are used: Bumping, MTP/OTP, Deep Trench, High Linearity MiM, Schottky Barrier Diode, ULL N/PMOS.
* no ULL N/PMOS available
Additional technology options are available for TSMC mini@sic:
TSMC mini@sic Pricelist | Standard prices | Discounted prices | |||
---|---|---|---|---|---|
EUR / min area | EUR / extra area | EUR / min area | EUR / extra area | ||
TSMC 0.18 MS RF (min area = 3 mm2) | 2,900 | 839 / 1 mm2 | 2,510 | 798 / 1 mm2 | |
TSMC 0.18 BCD Gen II (min area = 4 mm2) | 4,370 | 947 / 1 mm2 | 3,770 | 900 / 1 mm2 | |
TSMC 65 LP MS RF (min area = 1 mm2) | 3,720 | 310 / 0.1 mm2 | 3,120 | 295 / 0.1 mm2 | |
TSMC 40 LP MS RF (min area = 3 mm2) * | 15,395 | 490 / 0.1 mm2 | 14,626 | 466 / 0.1 mm2 | |
TSMC 28 HPC RF (min area = 1 mm2) * | 9,010 | 662 / 0.1 mm2 | 7,240 | 629 / 0.1 mm2 | |
TSMC 28 HPC+ RF (min area = 1 mm2) * | 9,010 | 662 / 0.1 mm2 | 7,240 | 629 / 0.1 mm2 |
Important notes:
This is a new flexible pricing with reduced minimal area.
The prices are area based, and the aspect ratio is free to choose but it is strongly recommended not to have sides less than 1mm.
Subdicing is not supported on mini@sic.
Design registration must be done at least 3 months in advance, preferably at the moment of reservation.
* The areas in the table for 28nm and 40nm are on-silicon dimensions. This means the designed area can be (area/0.81).
UMC MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
UMC 28N Logic/Mixed-Mode – HPC | 7 | 9 | 8 | 7 | |||||||||
UMC 40N Logic/Mixed-Mode – LP | 14 | 14 | 11 | 5 | 21 | ||||||||
UMC 65N Logic/Mixed-Mode/RF – LL | 3 | 7 | 16 | 18 | 31 | 5 | |||||||
UMC 55N Logic/Mixed-Mode/RF – SP | 3 | 7 | 16 | 18 | 31 | 5 | |||||||
UMC L110AE Logic/Mixed-Mode/RF | 28 | 25 | 27 | 22 | 24 | 5 | |||||||
UMC L130 Logic | 25 | 24 | |||||||||||
UMC L130 Mixed-Mode/RF | 25 | 24 | |||||||||||
UMC L180 Logic GII | 31 | 2 | 1 | 31 | |||||||||
UMC L180 Mixed-Mode/RF | 31 | 2 | 1 | 31 |
Important notes: Dates are GDS submission deadlines. Design registration must be done at least 3 weeks in advance.
Additional technology options are available:
UMC MPW Pricelist | Standard EUR / block | Disconunted EUR / block | |
---|---|---|---|
UMC L180 Logic GII, Mixed-Mode/RF | 13,400 1 | 12,740 1 | |
UMC L180 EFLASH Logic GII | 17,000 1 | 16,160 1 | |
UMC L130 Logic/Mixed-Mode/RF | 22,300 1 | 21,200 1 | |
UMC L110AE Logic/Mixed-Mode/RF | 24,600 1 | 23,380 1 | |
UMC L65nm Logic, Mixed-Mode/ RF – LL/SP | 35,350 2 | 33,600 2 | |
UMC 40N Logic/Mixed-Mode – LP | 68,450 2 | 65,040 2 | |
UMC 28N Logic/ Mixed-Mode – HPC | On request. Please, contact epumc@imec.be |
Important notes:
1 Price = per block of 5mm x 5mm needed to fit the design in.
2 Price = per block of 4mm x 4mm needed to fit the design in.
UMC mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
UMC 65N Logic/Mixed-Mode/RF – LL | 28 | 11 | 5 | ||||||||||
UMC L110AE Mixed-Mode/RF | 18 | 15 | 28 | ||||||||||
UMC L180 Mixed-Mode/RF | 24 | 25 | 25 | 24 |
Important notes: Dates are GDS submission deadlines. Design registration must be done at least 3 weeks in advance.
Additional technology options are available:
UMC mini@sic Pricelist | Standard EUR / block | Disconunted EUR / block | |
---|---|---|---|
UMC L180 Mixed-Mode/RF – 1P6M – 1.8V/3.3V * | 2,900 1 | 2,430 1 | |
UMC L130 Mixed-Mode/RF – 1P8M2T – 1.2V/3.3V * | 4,730 1 | 4,200 1 | |
UMC L65N Logic/Mixed-Mode LL ** | 9,190 2 | 8,630 2 |
Important notes:
1 Price = per block of 1525μm x 1525μm needed to fit the design in. Adding two blocks together to one block is possible.
2 Price = per block of 1875μm x 1875μm needed to fit the design in. Adding two blocks together to one block is possible.
* UMC 0.18 and 0.13μ mini@sic rules
When the standard block of 5mm x 5mm is divided into 9 regular square sub-blocks, customers participating in the mini@sic program can submit one sub-block or multiple sub-blocks, depending on the size of their design:
Final price = number of sub-blocks needed to fit in the design * sub-block price.
** UMC 65nm mini@sic rules
For the mini@sic program, customers can submit one sub-block or multiple sub-blocks, depending on the size of their design:
X-FAB MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
XH018 0.18µ HV NVM CMOS E-FLASH | 11 | 26 | 26 | 18 | |||||||||
XT018 0.18µ HV SOI CMOS | 4 | 29 | 14 | 16 | 11 | ||||||||
XS018 0.18µ OPTO * | 1 | 13 | |||||||||||
XP018 0.18µ NVM CMOS * | 8 | 7 | 4 | ||||||||||
XH035 0.35µ HV CMOS | 11 | 30 | 6 | 5 | |||||||||
XR013 0.13µ RF SOI CMOS * | 23 | 26 | 25 | 8 | |||||||||
XMB10 MEMS | 15 |
Important notes: Dates are GDS submission deadlines. Registration should be done at least 2 weeks in advance.
* In case of cancellation, there is a possibility to order these technologies by MLM.
Please take a look at additional technology options:
X-FAB MPW Pricelist | Standard EUR / mm² | Disconunted EUR / mm² | |
---|---|---|---|
X-FAB XH018 0.18μ HV NVM CMOS E-FLASH (MET3, MET4, METMID, MET-THK) | 1,605 | 1,525 | |
X-FAB XT018 0.18μ HV SOI CMOS (MET3, MET4, METMID, METTHK) | 1,635 | 1,555 | |
X-FAB XS018 0.18μ OPTO (MET3, MET4, MET5, METMID) | 1,375 | 1,310 | |
X-FAB XP018 0.18μ NVM CMOS (MET3, MET4, METMID, METTHK) | 1,415 | 1,345 | |
X-FAB XH035 0.35μ HV CMOS (MET4) | 1,035 | 985 | |
X-FAB XR013 0.13μ RF SOI CMOS (METRB, METBQ) | 1,830 | 1,745 | |
X-FAB XR013 0.13μ RF SOI CMOS (METTHK1, METRB, METRQ) | 2,280 | 2,165 | |
XMB10 MEMS | 10,500 1 | 9,800 1 |
Important notes:
Price = area (mm2) * price/mm2 with min. fabrication cost equivalent to 10mm2.
Area will be rounded upwards to the next mm2 (for instance, 12.24mm2 will be charged as 13mm2).
Backgrinding is not always possible and an additional cost might apply.
1 The price includes delivery of 5 dies with maximum size per die of 10mm2. Additional dies can be purchased for 10EUR/die (50 dies maximum).
X-FAB mini@sic | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
XH018 0.18µ HV NVM CMOS E-FLASH | 26 | 18 | |||||||||||
XT018 0.18µ HV SOI CMOS | 29 | 11 |
Important notes: Dates are GDS submission deadlines. Registration should be done at least 2 weeks in advance.
Please take a look at additional technology options:
X-FAB mini@sic Pricelist | Standard EUR / mm² | Disconunted EUR / mm² | |
---|---|---|---|
X-FAB XH018 0.18μ HV NVM CMOS E-FLASH (MET3, MET4, METMID, MET-THK) | 4,065 | 3,750 | |
X-FAB XT018 0.18μ HV SOI CMOS (MET3, MET4, METMID, METTHK) | 4,145 | 3,825 |
Important notes:
Price = per block of 1520μm x 1520μm needed to fit the design in. Adding two blocks together to one block is possible.
Backgrinding is not always possible and an additional cost might apply.
imec MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
imec Si-Photonics Passives+ 1 | 1 | ||||||||||||
imec Si-Photonics iSiPP50G | 9 | 24 | |||||||||||
imec SiN-Photonics BioPIX 300 | 3 | 31 | |||||||||||
imec GaN-IC on SOI 200V | 18 | ||||||||||||
imec GaN-IC on SOI 650V | 19 |
Important notes: Dates indicate deadlines for both Registration and submission of the first version of the GDS file.
1 The Q4 2022’s Silicon Photonics Passives+ run will be shifted to January 2023
imec MPW Pricelist Si-Photonics Passives+ 1, 2 | Standard EUR | Discounted EUR | |
---|---|---|---|
Half block – horizontal (5.15mm x 2.5mm) or vertical (2.5mm x 5.15mm) | 6,100 | 5,800 | |
1 block (5.15mm x 5.15mm) | 11,600 | 11,000 | |
2 blocks – horizontal (10.45mm x 5.15mm) or vertical (5.15mm x 10.45mm) | 20,600 | 19,600 | |
Larger sizes | Please, contact epsiphot@imec.be | ||
Extra Options | |||
Extra set of half block chips (10 samples) | +2,000 | +2,000 | |
Extra set of chips (1 block or larger; 20 samples) | +2,000 | +2,000 | |
Si-Photonics iSiPP50G 2 | |||
Quarter block (2.5mm x 2.5mm) | 10,000 | 9,500 | |
Half block – horizontal (5.15mm x 2.5mm) or vertical (2.5mm x 5.15mm) | 20,000 | 19,000 | |
1 block (5.15mm x 5.15mm) | 40,000 | 38,000 | |
2 blocks – horizontal (10.45mm x 5.15mm) or vertical (5.15mm x 10.45mm) | 80,000 | 76,000 | |
4 blocks (10.45mm x 10.45mm) | 150,000 | 142,500 | |
Larger sizes | Please, contact epsiphot@imec.be | ||
Extra Options | |||
Extra set of quarter block chips (10 samples) | +2,000 | +2,000 | |
Extra set of half block chips (10 samples) | +2,000 | +2,000 | |
Extra set of chips (1 block or larger; 20 samples) | +2,000 | +2,000 |
Important notes:
1 Imec Si-Photonics Passives technology is replaced by imec Si-Photonics Passives+ technology in 2019. Imec Si-photonics passives+ allows for metal heaters and edge-couplers, but its introduction also implies a few other changes to the offer. Existing users, please be cautious.
2 Number of prototypes in standard order depends on design size: 20 for 1 block or larger, 10 for half block or smaller.
Due to the nature of MPW logistics, more chips than ordered may sometimes be shipped.
imec MPW Pricelist SiN-Photonics BioPIX 300 and 150 | Standard EUR | Discounted EUR | ||
---|---|---|---|---|
1 block (5.30mm x 4.75mm) | 23,000 | 21,850 | ||
2 blocks – horizontal (10.75mm x 4.75mm) | 46,000 | 43,700 | ||
2 blocks – vertical (5.30mm x 9.65mm) | 46,000 | 43,700 | ||
4 blocks (10.75mm x 9.65mm) | 92,000 | 87,400 | ||
Larger sizes | Please, contact sinmpw@imec-int.com | |||
Extra Options | ||||
Extra set of chips (20 samples) | +1,000 | +1,000 |
Important notes:
Number of prototypes in base order: 20 samples, for each design block registration irrespective of the block size.
Due to the nature of MPW logistics, more chips than ordered may sometimes be shipped.
imec MPW Pricelist GaN-IC on SOI 200V and 650V | Standard EUR | Discounted EUR | |
---|---|---|---|
Area = 2.5mm x 5.18mm * | 17,000 | 16,150 | |
Area = 5.18mm x 5.18mm | 33,000 | 31,350 | |
Area = 10.54mm x 5.18mm | 66,000 | 62,700 | |
Extra Options | |||
Extra set of chips (40 samples) | +5,000 | +5,000 |
Important notes: Regular number of samples is 40 (Starting June 2021).
Due to the nature of MPW logistics, more chips than ordered may sometimes be shipped.
* This option is only available to academic institutions.
MEMSCAP MPW | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PolyMUMPs | 15 | 26 | |||||||||||
SOIMUMPS | 1 | 5 | 2 | ||||||||||
PiezoMUMPS | 11 | 3 | 6 |
Important notes: Dates indicate deadlines for both Registration and submission of the first version of the GDS file.
Fraunhofer IZM | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Fan-Out Wafer-Level Packaging (FOWLP) | 11* | 18** |
Important notes:
* FOWLP package design according Design Rules IZM (“Layout”): until April 11, 2022
Chips to be processed including 5 to 10 set-up chips: until May 27, 2022
** FOWLP package design according Design Rules IZM (“Layout”): until November 18, 2022
Chips to be processed including 5 to 10 set-up chips: until January 06, 2023
Fraunhofer IZM Pricelist | Standard EUR | Discount EUR | |
---|---|---|---|
Up to 30 Chips/Packages (other prices on request) | 14,400 | 12,000 | |
Up to 50 Chips/Packages | 20,400 | 17,000 | |
Up to 100 Chips/Packages | 27,600 | 23,000 | |
Each additional DRC per Design update | 900 | 750 |