Important notes: Dates are Registration deadlines. Final GDSII file must be submitted within 10 calendar days after this date.
The final chip area may not deviate by more than 5% from the registered area including the sealring.
* For research and prototyping purposes only.
MEMRES is available for IHP SG13S technology with extra charge.
TSV and RDL are available for IHP SG13S and SG13G2 technologies with extra charge.
Cu Pillar and Bumping are available for all IHP technologies with extra charge; SG13C on request.
Local Backside Etching (LBE) is not offered for EPIC runs and runs with Cu-BEOL.