ASIC PACKAGING

ASIC packaging

STANDARD PACKAGING

ACCESS CONDITIONS

It is important that our customers access packaging services via the same EUROPRACTICE partner that was responsible for the fabrication of their prototypes. For instance, if you had your prototypes fabricated via imec, you should also access packaging services through imec.

PRICE STRUCTURE

The prices below are valid for all packages and bonding of designs with pad pitch of min. 90 microns
Minimum package order depends on the EUROPRACTICE partner you work with.
Fraunhofer and imec: minimum quantity is 10 packages per design.
CMP: minimum quantity is 5 packages per design.
Cost for wire bonding length < 6mm and a passivation opening > 55µm x 55µm
Cost for removable glass lids for 1 to 20 packages: €150; for more than 20 packages: €7,50 per package

Please make sure you follow ASIC Package Design Rules and download the GDS file containing available packages within EUROPRACTICE:

EUROPRACTICE packaging offer is wider than the options listed below. Please contact us for more details.

For Fraunhofer and imec customers, all CPGA and CERQUAD FP packages require a setup cost of €200 per bonding diagram. A setup cost is not involved for DIL, CSOIC, CLCC and JLCC.

For CMP customers, a preparation fee is €100 per bonding diagram and there is no fee required for EUROPRACTICE members.

Standard Ceramic Packaging: Price per one item
Type	EUR
Dual-in-line
DIL 16	46
DIL 18	58
DIL 24	53
DIL 28	56
DIL 40	58
DIL 48	68
Ceramic Small Outline Integrated Circuit
CSOIC 16	74
CSOIC20	86
CSOIC24	89
CSOIC 28	93
C-Leadless Chip Carriers
CLCC 44	59
CLCC 68	80
CLCC 84	81
J-Leaded Chip Carriers
JLCC44	77
JLCC 68	89
JLCC 84	102
Ceramic Pin Grid Array
CPGA	87
CPGA 100	100
CPGA 120	112
CPGA 144	122
CPGA 208	197
CPGA 256	239
Ceramic Quad Flat Package
CERQUAD FP 64	95
CERQUAD FP 120	131
CERQUAD FP 128	135
CERQUAD FP 160	149
CERQUAD FP 208	187

The silicon thickness for “Open-Pak” plastic types may not exceed 280µm (11 mils). Please check it with the partner responsible for the technology in question.
For the QFN packages, EUROPRACTICE uses default epoxy sealed lids. “Taped” lids can be provided on request and responsibility of the customer. However, we cannot guarantee that “taped” lids do not come loose during transport. EUROPRACTICE takes no responsibility in this case.

A setup cost for plastic Open-Pak SOIC and QFN is €300.

Plastic “Open-Pak” Packages: Price per one item
Type	EUR
Small Outline IC
SOIC 16	64
SOIC 20	69
SOIC 24	72
SOIC 28	79
Quad-Flat No-leads
QFN 12 (4×4)	49
QFN 16 (5×5)	50
QFN 20 (5×5)	61
QFN 24 (5×5)	62
QFN 24 (6×6)	65
QFN 28 (4×4)	62
QFN 28 (5×5)	62
QFN 28 (6×6)	65
QFN 32 (5×5)	73
QFN 32 (7×7)	76
QFN 36 (6×6)	76
QFN 40 (5×5)	77
QFN 40 (6×6)	77
QFN 48 (7×7)	81
QFN 56 (8×8)	87
QFN 64 (9×9)	98
QFN 80 (12×12)	107
QFN 88 (10×10)	118
QFN 100 (12×12)	131

Plastic packages for small quantities (<100 units)

applicable to standard plastic packages available as open-tool on the market
assembly cost on request
extra delivery time

CUSTOMIZED PACKAGING

Novel applications and prototypes sometimes need customised assembly. Therefore, together with standard packaging, EUROPRACTICE offers a wide range of custom solutions, ranging from simple custom wirebonds to complex multilayer optoelectronic sub-assembly.

To benefit from customized packaging solutions, please contact one of the EUROPRACTICE partners:

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Schedules and Prices

ASIC PACKAGING

STANDARD PACKAGING

ACCESS CONDITIONS

PRICE STRUCTURE

CUSTOMIZED PACKAGING