[vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”full_width” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern”][vc_column][qode_accordion style=”toggle”][qode_accordion_tab title=”Multi-Project Fan-Out Wafer Level Packaging” el_id=”Multi-Project”][vc_column_text]This service is accessible for all EUROPRACTICE customers. It is provided by our partner Fraunhofer.[/vc_column_text][vc_empty_space height=”24px”][vc_table allow_html=”1″][borders_all;align-left;11px;b]Design%20Rules%20%26%20Materials,[borders_all;align-left;11px]Multi-project%20wafer%20processing%20is%20an%20established%20approach%20in%20semiconductor%20manufacturing%20for%20fast%20and%20low-cost%20prototyping.%20This%20idea%20is%20now%20transferred%20to%20fan-out%20wafer%20level%20packaging.%20Here%20dies%20from%20different%20sources%20or%20different%20technologies%20with%20varying%20thickness%20and%20size%20can%20be%20handled%20and%20packaged%20with%20one%20integration%20technology.%20This%20offers%20a%20path%20to%20a%20well%20adopted%20technology%2C%20especially%20for%20RF%20applications.|[borders_all;align-left;11px;b]MPFOWL%20Package%20Specification,[borders_all;align-left;11px]Die%20delivery%3A%20WafflePack%2C%20wafer%2C%20wheel%3Cbr%20%2F%3E%0ADie%20size%3A%201.5%20%E2%80%93%207%20mm%20edge%20length%3Cbr%20%2F%3E%0ADie%20thickness%3A%20200%20%E2%80%93%20300%20%CE%BCm%3Cbr%20%2F%3E%0APackage%20thickness%3A%20450%20%CE%BCm%3Cbr%20%2F%3E%0APackage%20size%3A%2010×10%20mm%C2%B2%2C%20smaller%20package%20size%20possible%20with%20extra%20effort%3Cbr%20%2F%3E%0AMetal%20layers%3A%202%3Cbr%20%2F%3E%0AIntegration%20of%20e.g.%20antennas%20and%20passive%20structures%20in%20RDL%3Cbr%20%2F%3E%0APin-out%3A%20BGA%3Cbr%20%2F%3E%0A-%20Pitch%3A%20500%20%CE%BCm%3Cbr%20%2F%3E%0A-%20Ball%20size%3A%20300%20%CE%BCm%3Cbr%20%2F%3E%0A-%20Solder%3A%20SnAgCu%3Cbr%20%2F%3E%0ADefined%20packaging%20materials[/vc_table][vc_empty_space height=”24px”][vc_column_text]You can find more details in the MPFOWLP flyer[/vc_column_text][vc_empty_space height=”24px”][vc_single_image image=”16393″ img_size=”full” qode_css_animation=””][vc_empty_space height=”24px”][vc_column_text]Contact
Dr. Tanja Braun
e-mail: europractice@izm.fraunhofer.de
Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin, Germany
www.izm.fraunhofer.de[/vc_column_text][vc_empty_space height=”24px”][/qode_accordion_tab][qode_accordion_tab title=”OPEN 3D post-process for 3D integration” el_id=”OPEN 3D”][vc_column_text]CMP, in partnership with CEA-LETI, offers a set of post-processes allowing various types of 3D assemblies.
These wafer-level services are available only for the customers of the EUROPRACTICE partner CMP.
Those post-processes are operated at wafer-level and are carried out after standard MPW runs on a selected subset of technologies. The goal is to integrate 3D interconnections to chips processed through CMP, in order to enable flip-chip on organic or ceramic substrates as well as Die-to-Die or Die-to-Interposer assemblies.
Two types of post-processes are available, including different options:
Technology characteristics:[/vc_column_text][vc_empty_space height=”24px”][vc_table][borders_all;align-left;11px;b]%C2%B5Bumps%20(Cu-pillar),[borders_all;align-left;11px]Cu%2FSnAg%20%3B%20%C3%B825%20%C2%B5m%20%3B%2050%20%C2%B5m%20min%20pitch%20%3B%20~20%20%C2%B5m%20thickness|[borders_all;align-left;11px;b]UBM,[borders_all;align-left;11px]TiNiAu%20%3B%2025%20%C2%B5m%20%20min%20width%3B%2050%20%C2%B5m%20%20min%20pitch%20%3B%201%20%C2%B5m%20thickness|[borders_all;align-left;11px;b]TSV-LAST,[borders_all;align-left;11px]%C3%9860%20%C2%B5m%20x%20120%20%C2%B5m%20depth%20%3B%20120%20%C2%B5m%20min%20pitch|[borders_all;align-left;11px;b]Backside%20RDL,[borders_all;align-left;11px]Cu%20%3B%2020%20%C2%B5m%20min%20width%20%3B%2040%20%C2%B5m%20min%20pitch%20%3B%204-8%20%C2%B5m%20Thickness[/vc_table][vc_empty_space height=”24px”][vc_empty_space height=”24px”][vc_column_text]Accessibility conditions:
MPW OPEN 3D post processes are available for projects and wafers processed through CMP on the last CMP MPW run of the year for the following technologies:[/vc_column_text][vc_empty_space height=”24px”][vc_table][borders_all;align-left;11px;b]ams,[borders_all;align-left;11px]C35B4M3|[borders_all;align-left;11px;b]CEA-LETI,[borders_all;align-left;11px]Silicon%20Photonics|[borders_all;align-left;11px;b]STMicroelectronics,[borders_all;align-left;11px]CMOS28FDSOI%20(frontside%20only)%2C%20BiCMOS055%2C%20CMOS065%2C%20BiCMOS9MW[/vc_table][vc_empty_space height=”24px”][vc_column_text]Those runs are subject to a certain minimum number of participants sharing the MPW.
MPW OPEN 3D post‐processes must be anticipated at an early stage as they require an additional NDA, the distribution of a specific DRM and an add‐on to the Design‐Kit. Additionaly, this must be indicated it in the reservation form.
Dedicated OPEN3D post processes can be made available on any CMP MPW Run at any time of the year after a feasibility study. In this case, restrictions to specific geometrical parameters of the design structure are not imposed and can be chosen within a process window. Please contact CMP for more information/quotation.
Application area:
3D/2.5D integration
Design kit version:
CMP/LETI 3D add-on is required to design post-processed modules
Verification tools:
DRC calibre die-level; DRC calibre 3Dstack for assembly-level checks (at CMP only)
Libraries:
3D modules Library
Packaging:
OPEN 3D post processing is available upon request, please contact ajith-sivadasan.moreau@mycmp.fr for more information on packaging solutions.[/vc_column_text][/qode_accordion_tab][qode_accordion_tab title=”ams 0.35µm Wafer-level bumping” el_id=”ams Wafer-level bumping”][vc_column_text][/vc_column_text][vc_column_text]Fraunhofer and CMP provide access to this ams technology.[/vc_column_text][vc_empty_space height=”24px”][vc_single_image image=”16010″ img_size=”full” qode_css_animation=””][vc_empty_space height=”24px”][vc_table allow_html=”1″][borders_all;align-left;11px;b]Technology%20characteristics,[borders_all;align-left;11px]Solder%20bumping%20consists%20in%20manufacturing%20metal%20spheres%20acting%20as%20interconnections%20for%20flip-chip.%20Those%20spheres%20are%20composed%20of%20a%20Sn%2FAg%2FCu%20alloy%20(SAC).%20Before%20the%20sphere%20can%20be%20deposited%2C%20the%20deposition%20of%20an%20Under%20Bump%20Metalization%20(UBM)%20layer%20is%20required.%3Cbr%20%2F%3E%0A%0AThis%20option%2C%20available%20on%20ams%200.35%20%26%200.18%20runs%20only%2C%20is%20operated%20at%20wafer-level%20within%20ams%20cleanroom%20after%20CMOS%20process.%20It%20allows%20the%20deposition%20of%20an%20array%20of%20solder%20balls%20at%20wafer-level%2C%20with%20an%20I%2FO%20pitch%20compatible%20with%20traditional%20printed%20circuit%20board%20(PCB)%20assembly%20processes.%20For%20mechanical%20reasons%20solder%20balls%20are%20usually%20evenly%20distributed%20over%20the%20whole%20chip%20surface%20and%20electrically%20connected%20to%20the%20IC%E2%80%98s%20CMOS%20pads%20by%20means%20of%20a%20redistribution%20layer%20(RDL)%20included%20in%20the%20option.|[border_bottom;b;11px;align-left]Application%20area,[border_bottom;align-left]Single%20die%20flip-chip%20packaging|[borders_all;align-left;11px;b]Design%20Kit%20version,[borders_all;align-left;11px]Option%20supported%20by%20ams%20hitkit%204.10%20ISR15%2C%20through%20an%20add-on[/vc_table][vc_empty_space height=”24px”][/qode_accordion_tab][qode_accordion_tab title=”STMicroelectronics Wafer-level bumping” el_id=”STM Wafer-level bumping”][vc_column_text]This technology is provided by CMP. Copper pillars are manufactured at wafer-level by STMicroelectronics. This interconnection is composed of an Under Bump Mettalization (UBM), upon which a pillar of copper is grown, a capping of Sn/Ag allows the die to be assembled on a substrate by reflow process. The dimensions of this copper pillar are approximately 62 µm in diameter for 65 µm in height, thus allowing a fine pitch (down to 90 µm).
Accessibility conditions:
More detailed techical information is available on the CMP website.[/vc_column_text][vc_empty_space height=”24px”][/qode_accordion_tab][/qode_accordion][/vc_column][/vc_row][vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”full_width” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern”][vc_column][vc_empty_space][/vc_column][/vc_row]
