System integration is the challenge of combining devices from different technologies on the same platform or in the same package.
It is used in a wide variety of technologies, such as microelectronics, optics, photonics, MEMS, microfluidics and combinations of these put together, also known as Hybrid Integration.
Examples of system integration in the semiconductor industry are vast, such as high-speed high-density Datacom transceivers, compact high-speed telecom receivers and bio-medical sensors to name a few.
We speak about System Integration when we combine at least two devices stacked and interconnected, or packaged side-by-side on a substrate.
These combinations are made possible through access to a variety of specialised services of key enabling technologies. This includes pick-and-place, flip-chip, Ball Grid Arrays (BGAs), Cu pillars, wafer-level fan-outs as well as silicon interposers, which facilitate 2.5/3D integration of ASICs and Photonic Integrated Circuits (PICs) through die stacking techniques.
You can explore these solutions in our offer below.
System Integration opens up new technology and application possibilities. This can be beneficial on many levels, from energy savings through lower power consumption, to faster data rates, better signal integrity and smaller footprints.
EUROPRACTICE offers advanced fibre attaches. This includes single-mode optical fibre (SMF), polarization-maintaining optical fibre (PMF), single fibre and arrays, as well as single lensed fibre. You can find detailed information on the Photonic Packaging page