Important notes: Dates are Registration deadlines. Final GDSII file must be submitted within 10 days after this date.
* Additional MPW runs are offered only on request and when the cumulative area > 10 mm².
** Additional MPW runs are offered only on special request.
MEMRES is available for the IHP SG13S technology with extra charge.
TSV and RDL are available for IHP SG13S and SG13G2 technologies with extra charge.
Cu Pillar and Bumping are available for all IHP technologies with extra charge.
Local Backside Etching (LBE) is not offered for EPIC runs and runs with Cu-BEOL.