Important notes:
Dates are Registration and Export Control information deadlines. Please download the Export Control file here.
Final GDSII file must be submitted within 10 calendar days after this date.
Final chip area incl. Sealring_complete must be provided 7 calendar days after the regsitration
The final chip area may not deviate by more than 5% from the registered area including the sealring.
Chip thickness different from 300µm or 200µm require extra fee.
MEMRES is available for IHP SG13S technology with extra charge.
TSV is available for IHP SG13S and SG13G2 technologies with extra charge.
Cu Pillar and Bumping are available for all IHP technologies with extra charge; SG13C on request.
Local Backside Etching (LBE) is not offered for EPIC runs and runs with Cu-BEOL.
* For research and prototyping purposes only.