EUROPRACTICE provides access to the XMB10 MEMS process from X-FAB in MPW mode.
The MEMS industry has many challenges with many unique processes and long development times. When time-to-market is critical, X-FAB offers a solution with ready-to-use processes, such as Open Platform technology XMB10 for 3-Axis Inertial Sensors.
X-FAB XMB10 MEMS | |
|---|---|
Technology characteristics | Single, double or triple axis inertial sensor using cavity SOI wafer based technology.
Sensor elements formed by silicon DRIE process.
Optional top and bottom metal layers.
Top cap wafer: Silicon with etched cavities and bond pad openings.
Cost effective wafer level packaging by wafer bonding. |
Special features | Recessed fingers enable sensing in Z-direction.
100% efficient silicon mass possible.
Refilled isolated trenches.
Metal connections to the movable sensor structures.
Wire crossing allowed.
Small device size.
Low parasitic capacitances.
Low inside cavity pressure. |
Here you can check out the list of extra Technology Options available via EUROPRACTICE:
