GLOBALFOUNDRIES

Technologies

GLOBALFOUNDRIES

45SPCLO is a 45 nm generation, SOI, CMOS technology that supports (ASIC) designs and custom logic designs. It offers power, area, and performance advantages and efficiency providing more data per watt per fibre per Laser. Monolithic integration of RF, digital and Si-Photonic circuits with higher energy efficiency and higher modulation speed. Ideal for applications like Automotive Lidar, IoT, Cloud, Frictionless Networking, Virtualization and Hierarchical AI.

GF 45 SPCLO Silicon-Photonics
Technology characteristics
CMOS technology substrate resistivity is in the range of 9-18 ohm-cm
Core Voltages: 0.9V, 1V, IO Voltages: 1.5V, 1.8V
1.12 nm thin gate oxide for 0.9 V
2.5 nm thick gate oxide for 1.5 V and 1.8 V
Mini. lithographic image of 40 nm (gate only)
Operating junction temperature: -40°C to 125°C
One BEOL STACK options: 9LM Metallization stack
Seven levels of all-copper global metal
1x, 2x, and 8x thick wires at relaxed pitches
Low-K and TEOS/FTEOS Inter Level Dielectrics
Planarized passivation and interlevel dielectrics
High-value resistor 1.5K Ohms/square
Photonic offering
C-band (1550 nm) coherent transceivers modules
O-band (1310 nm) direct detect transceivers
Photonic waveguide
Polarization splitter & rotator, modulators, detectors
Phase shifter, connection options (Polymer bundle or Fiber Butt)
Vertical grating incoupler: iograt
Device offering
Regular Vt, floating-body FETs
Ultrahigh Vt, floating-body FETs
Analog, body-contacted FETs
Thick-oxide, body-contacted FETs
Precision resistors,Thick-oxide decoupling capacitor
Efuse, Ge EPI Photo diode, Nitride wave guide in MOL
Wafer size
12inch
Manufacturing location
Fab8 – Malta, New York, USA
Deliverables
50 dies for general MPW and 50 dies for mini@sic run
Signoff tools
Cadence, Synopsys, Mentor Graphics
Dummy filling
By customer
MPW block size
25mm² with fix dimensions of 5mm x 5mm
MPW Turnaround time
5-6 months
Mini@sic characteristics
Supported
Block size: 5mm x 2.455mm or 2.455mm x 5mm (Pre-Shrink die size)
Bumping
Upon request