TSMC

Technologies

TSMC

EUROPRACTICE customers can access the following TSMC technologies.

OVERVIEW

This is an overview of the most popular TSMC technologies. You can find more technology flavours in the ‘Details’ section below.

DETAILS

The 0.18 HV technololgy is based on the 1.8V/5V MS technology and adds 5V, 6V, 7V, 8V, 12V, 16V, 20V, 24V, 29V, 36V, 45V, 55V, 65V and 70V devices, aiming for high-voltage power management and automotive applications.

0.18µm CMOS High Voltage BCD Gen II
Technology characteristics	Shrink technology: NO Core voltage1.8V I/O voltage 5V Shallow Trench Isolation (STI) Wells: Retrograde four well on -100- P- substrate wafer. Four LV wells, two HV wells and N+ Buried Layer (NBL) Substrate resistivity 8~12 ohm.cm on -100- P- substrate Standard Vt Temperature range -40C to 150C # of metals: 3 to 6 Interconnect material: AlCu Interconnect dielectric: FSG Top metal: 8KA, 15KA, 30KA or 40KA CMP on STI, contact, via and inter-metal dielectric layers OTP / MTP MoM MiM: 1fF/µm² or 2fF/µm², mutual exclusive Passivation: single
Wafer size	8 inch
Deliverables	# of dies (no wafer!): 40 dies / wafer
Design tools	PDK: Cadence CDBA and OA
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics
Verification tools LVS	Cadence, Mentor Graphics
Parasitic extraction tools	Cadence, Synopsys
P&R tools	Cadence, Synopsys
Foundry IP	10-track core cell library, with 5V I/O devices, SVt 1.8V/5V linear universal standard I/O 5V/5V linear universal standard I/O SRAM compilers by ARM, Dolphin Integration, Synopsys
MPW block size	Min. 25 mm², flexible aspect ratio
Mini@sic characteristics	Supported Min area size: 4mm² mini@sic Technology options

TSMC 0.18 µm technology with 6 metal layers. Highly suited for MS/RF applications for today’s IoT and smart wearable innovations.

0.18µm CMOS Logic or MS/RF, General Purpose 1.8V/3.3V
Technology characteristics	Shrink technology: NO Core voltage1.8V I/O voltage 3.3V Shallow Trench Isolation (STI) Triple well (retrograde NW, PW and optional DNW) Substrate resistivity 8~12 ohm.cm on <100> P- substrate Standard Vt, Medium Vt NMOS and medium Vt PMOS, native NMOS HRI poly resistor Temperature range -40C to 125C # of metals: 3 to 6 Interconnect material: AlCu Interconnect dielectric: FSG Top metal: 8KA, 20KA or 40KA RDL: 8KA, limited offer in FAB8 Inductors MoM MiM: 1fF/µm² or 2fF/µm², mutual exclusive Passivation: single
Options that need special attention	OTP / MTP
Wafer size	8 inch
Deliverables	40 dies / wafer
Design tools	Cadence CDBA, Cadence OA, TSMC iPDK
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Magma, Cadence, Synopsys, Mentor Graphics
Verification tools LVS	Magma, Cadence, Synopsys, Mentor Graphics
Parasitic extraction tools	Cadence, Synopsys, Mentor Graphics
P&R tools	Cadence, Synopsys
Foundry IP	Standard cells: 7-track. Gate density >= 140KGates / mm² I/O library 3.3V SRAM: from third party
MPW block size	Min. 25 mm², flexible aspect ratio
Mini@sic characteristics	Supported Min area: 3mm² mini@sic Technology options

TSMC 0.18 µm technology with 6 metal layers. Highly suited for MS/RF applications for today’s IoT and smart wearable innovations.

0.18µm CMOS Logic or MS/RF, General Purpose 1.8V/5V
Technology characteristics	Shrink technology NO Core voltage1.8V I/O voltage 5V Shallow Trench Isolation (STI) Triple well (retrograde NW, PW and optional DNW) Substrate resistivity 8~12 ohm.cm on <100> P- substrate Standard Vt, Medium Vt NMOS and medium Vt PMOS HRI poly resistor Temperature range -40C to 125C # of metals: 3 to 6 Interconnect material: AlCu Interconnect dielectric: FSG Top metal: 8KA, 20KA or 40KA RDL: 8KA, limited offer in FAB8 Inductors MoM MiM: 1fF/µm² or 2fF/µm², mutual exclusive Passivation: single
Options that need special attention	OTP / MTP
Wafer size	8 inch
Deliverables	40 dies / wafer
Design tools	Cadence CDBA, Cadence OA, TSMC iPDK
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Magma, Cadence, Synopsys, Mentor Graphics
Verification tools LVS	Magma, Cadence, Synopsys, Mentor Graphics
Parasitic extraction tools	Cadence, Synopsys, Mentor Graphics
P&R tools	Cadence, Synopsys
Foundry IP	Standard cells: 7-track. Gate density >= 140KGates / mm² I/O library 3.3V SRAM: from third party
MPW block size	Min. 25 mm², flexible aspect ratio
Mini@sic characteristics	Not supported

For applications in consumer electronics, computers, mobile computing, automotive electronics, IoT, and smart wearables.

0.13µm CMOS Logic or MS/RF, General Purpose
Technology characteristics	Shrink technology: NO Core voltage: 1.2V I/O voltage: 2.5 or 3.3V Shallow Trench Isolation (STI) Wells: Retrograde twin well cmos technology on <100> P-substrate. Substrate resistivity 8-12ohm-cm Tripple Well, Deep N-well (optional) Vt options: lvt, svt, hvt,uhvt, native Temperature range: -40C to 125C # of metals: 3 to 8 +ALRDL Interconnect dielectric: FSG Top metal: 8KA CMP on STI, contact, via and inter-metal dielectric layers MoM Varactors
MS/RF options	MIM capacitor for MS & RF process: 1fF/µm² High-Q copper inductor Top metal: UTM, 33.5K Single passivation, Dual passivation optional
Wafer size	8/12 inch
Deliverables	# of dies (no wafer!): 40-dies (8″), 100 dies (12″) / wafer
Design tools	PDK: Cadence CDBA and OA, Mentor
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics
Verification tools LVS	Cadence, Mentor Graphics
Parasitic extraction tools	Cadence, Mentor Graphics
P&R tools	Cadence, Synopsys
Foundry IP	9-track core cell library, with 5V I/O devices, SVt 1.2/3.3V regular,linear universal standard I/O 1.2V/2.5V & 1.2/3.3V Universal Analog I/O compatible with Linear Universal Standard I/O 1.2V/2.5V & 1.2/3.3V , hybrid linear slim I/O library that contains both standard and analog slim I/O 5V tolerant, linear universal standard I/O 1.2V/3.3V, 5V tolerant, staggered universal standard I/O SRAM compilers from 3rd party
MPW block size	Min. 25 mm², flexible aspect ratio
Mini@sic characteristics	Not supported

For applications in consumer electronics, computers, mobile computing, automotive electronics, IoT, and smart wearables.

0.13µm CMOS Logic or MS/RF, Low Power
Technology characteristics	Shrink technology: NO Core voltage: 1.5V I/O voltage: 2.5 or 3.3V Shallow Trench Isolation (STI) Wells: Retrograde twin well cmos technology on <100> P-substrate. Substrate resistivity 8-12ohm-cm Tripple Well, Deep N-well (optional) Vt options: lvt, svt, native Temperature range: -40C to 125C # of metals: 3 to 8 (CU) (+ALRDL) Interconnect dielectric: FSG Top metal: 8KA CMP on STI, contact, via and inter-metal dielectric layers MoM Varactors
MS/RF options	MIM capacitor for MS & RF process: 1fF/µm² High-Q copper inductor Top metal: UTM, 33.5K Single passivation, Dual passivation optional
Wafer size	8/12 inch
Deliverables	# of dies (no wafer!): 40-dies (8″), 100 dies (12″) / wafer
Design tools	PDK: Cadence CDBA and OA, Mentor
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics
Verification tools LVS	Cadence, Mentor Graphics
Parasitic extraction tools	Cadence, Mentor Graphics
P&R tools	Cadence, Synopsys
Foundry IP	9-track core cell library
MPW block size	Min. 25 mm², flexible aspect ratio
Mini@sic characteristics	Not supported

This is a general-purpose product for applications with a 1.0V core design and with 1.8, 2.5 or 3.3V capable IO’s for digital consumer, Networking , HDD and FPGA.

90nm CMOS Logic or MS/RF, General Purpose
Technology characteristics	Shrink technology: NO Core voltage: 1.0V I/O voltage: 1.8, 2.5 or 3.3V Shallow Trench Isolation (STI) Wells: Retrograde twin well cmos technology on P-substrate Tripple Well, Deep N-well (optional) Multiple Vt options (lvt, svt, hvt, native) Dual gate oxide and tripple gate oxide process Temperature range: -40C to 125C # of metals: 3 to 9 (+ALRDL) Interconnect material: Cu + AlCu pad LK inter-metal dielectric for thin metal Top metal: 5.6 KA, 8.5KA CMP on STI, contact, via and inter-metal dielectric layers MoM
MS/RF options	MIM capacitor for MS & RF process: 1.0, 1.5, 2.0 fF/µm²(mutually exclusive) High-Q copper inductor Top metal: UTM, 34KA Varactors Dual passivation
Options that need special attention	Fuse RAM
Wafer size	12 inch
Deliverables	# of dies (no wafer!): 100 dies / wafer (12″)
Design tools	PDK: Cadence CDBA, Cadence OA, Mentor, iPDK
Simulation tools	Hspice, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics
Verification tools LVS	Cadence, Mentor Graphics
Parasitic extraction tools	Cadence, Mentor Graphics
P&R tools	Cadence, Synopsys
Foundry IP	7,9,14-track core cell library, multi-Vt 1.0V/2.5V &1.0V/3.3V hybrid staggered slim I/O library that contains both standard and analog slim I/O 1.0V/2.5V &1.0V/3.3V linear staggered slim I/O library that contains both standard and analog slim I/O 1.0v/2.5v, 3.3v tolerant, staggered universal standard I/O 1.0V/3.3V, 5V Tolerant, Staggered Universal Standard I/O SRAM compilers from 3rd party
MPW block size	16 mm², flexible aspect ratio
Mini@sic characteristics	Not supported

This is a general-purpose product for applications with a 1.2V core design and with 2.5 or 3.3V capable IO’s for mobile applications, such as Cellular, WLAN, BT.

90nm CMOS Logic or MS/RF, Low Power
Technology characteristics	Shrink technology: NO Core voltage: 1.2V I/O voltage: 2.5 or 3.3V Shallow Trench Isolation (STI) Wells: Retrograde twin well cmos technology on P-substrate Tripple Well, Deep N-well (optional) Multiple Vt options (ulvt, lvt, svt, hvt, native) Dual gate oxide and tripple gate oxide process Temperature range: -40C to 125C # of metals: 3 to 9 (CU) (+ALRDL) Interconnect material: Cu + AlCu pad LK inter-metal dielectric for thin metal Top metal: 5.6 KA, 8.5KA CMP on STI, contact, via and inter-metal dielectric layers MoM Varactors
MS/RF options	MIM capacitor for MS & RF process: 1.0, 1.5, 2.0 fF/µm²(mutually exclusive) Ultra Low Vt High-Q copper inductor Top metal: UTM, 34KA Dual passivation
Options that need special attention	Fuse RAM
Wafer size	12 inch
Deliverables	# of dies (no wafer!): 100 dies / wafer (12″)
Design tools	PDK: Cadence CDBA and OA
Simulation tools	Hspice, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics
Verification tools LVS	Cadence, Mentor Graphics
Parasitic extraction tools	Cadence, Mentor Graphics
P&R tools	Cadence, Synopsys
Foundry IP	7,9,14-track core cell library, multi-Vt 1.2v/2.5v &1.2V/3.3V Universal Analog I/O compatible with Linear Universal Standard I/O 1.2V/2.5V & 1.2V/3.3V Regular, Linear Universal Standard I/O 1.2V/3.3V, regular, linear standard slim I/O 1.2V/3.3V, hybrid staggered slim I/O library that contains both standard and analog slim I/O SRAM compilers from 3rd party
MPW block size	16 mm², flexible aspect ratio
Mini@sic characteristics	Not supported

It is a popular and well supported node.

65nm CMOS Logic or MS/RF, General purpose
Technology characteristics	Shrink technology: NO Core voltage: 1.0V I/O voltage: 2.5V (1.8V underdrive, 3.3V overdrive) Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Optional Deep N-Well <100> P- substrate wafer. Substrate resistivity 8-12ohm-cm Dual Gate Oxide (1 for core, 1 for IO) Vt options: lvt, svt, hvt, native Temperature range: -40C to 125C # of metals: 3 to 9 Cu + alrdl Interconnect dielectric: LK Top metal: 5KA, 9KA, 12.5KA, 34KA CMP on STI, contact, metals, vias and passivation MoM MiM density: 1fF/µm², 1.5fF/µm² or 2fF/µm², mutually exclusive Passivation: dual layers
Options that need special attention	OTP/MTP SRAM Cell
Wafer size	12 inch
Deliverables	# of dies (no wafer!): 100 dies / wafer
Design tools	PDK: Cadence CDBA and OA, TSMC iPDK, Mentor
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics, Synopsys, Magma, TSMC iDRC
Verification tools LVS	Cadence, Mentor Graphics, Synopsys, Magma
Parasitic extraction tools	Cadence, Mentor Graphics, Synopsys
P&R tools	Cadence, Synopsys
Foundry IP	12-track / 10-track / 9-track core cell libraries, multi-vt, coarse grain 1.0V/2.5V staggered (fail-safe digital, 5V input tolerant digital, hybrid small footprint digital/analog and regular analog) I/O library SRAM compilers from 3rd party
MPW block size	12 mm²
Mini@sic characteristics	Not supported

It is a popular and well supported node.

65nm CMOS Logic or MS/RF, Low Power
Technology characteristics	Shrink technology: NO Core voltage: 1.2V I/O voltage: 2.5V (1.8V underdrive, 3.3V overdrive) Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Optional Deep N-Well <100> P- substrate wafer. Substrate resistivity 8-12ohm-cm Dual Gate Oxide (1 for core, 1 for IO) Vt options: lvt, svt, hvt, mLowvt, native Temperature range: -40C to 125C # of metals: 3 to 9 Cu + alrdl Interconnect dielectric: LK Top metal: 5KA, 9KA, 12.5KA, 34KA CMP on STI, contact, metals, vias and passivation MoM MiM density: 1fF/µm², 1.5fF/µm² or 2fF/µm², mutually exclusive Passivation: dual layers
Options that need special attention	OTP/MTP SRAM Cell
Wafer size	12 inch
Deliverables	# of dies (no wafer!): 100 dies / wafer
Design tools	PDK: Cadence CDBA and OA, TSMC iPDK, Mentor
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics, Synopsys, Magma, TSMC iDRC
Verification tools LVS	Cadence, Mentor Graphics, Synopsys, Magma
Parasitic extraction tools	Cadence, Mentor Graphics, Synopsys
P&R tools	Cadence, Synopsys
Foundry IP	12-track / 10-track / 9-track / 7-track core cell libraries, multi-vt, coarse grain 1.2V/2.5V staggered (fail-safe digital, 5V input tolerant digital, hybrid small footprint digital/analog and regular analog) I/O library 1.2V/2.5V linear (digital, hybrid small footprint digital/analog and regular analog) I/O library SRAM compilers
MPW block size	12 mm²
Mini@sic characteristics	Supported Min area: 1mm² mini@sic Technology options

Well supported advanced node, 40G = 45GS.

40nm CMOS Logic or MS/RF, General Purpose
Technology characteristics	Shrink technology: YES Core voltage: 0.9V I/O voltage: 2.5V (1.8V underdrive, 3.3V overdrive) or true 1.8V Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Optional Deep N-Well <110> P- substrate wafer. Substrate resistivity 8-12ohm-cm Dual Gate Oxide (1 for core, 1 for IO) Vt options: lvt, svt, hvt, native Temperature range: -40C to 125C # of metals: 3 to 10 Cu + alrdl Interconnect dielectric: ELK Top metal: 3.1KA, 9KA, 12.5KA, 34KA CMP on STI, contact, metals, vias and passivation MoM Passivation: dual layers
Options that need special attention	OTP/MTP SRAM Cell
Wafer size	12 inch
Deliverables	# of dies (no wafer!): 100 dies / wafer
Design tools	PDK: Cadence CDBA and OA, TSMC iPDK
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics, Synopsys, Magma, TSMC iDRC
Verification tools LVS	Cadence, Mentor Graphics, Synopsys, Magma, TSMC iLVS
Parasitic extraction tools	Cadence, Mentor Graphics, Synopsys
P&R tools	Cadence, Synopsys
Foundry IP	12-track / 9-track core cell libraries, multi-vt, coarse grain 0.9V/1.8V staggered (fail-safe digital, 5V input tolerant digital and regular analog) I/O library 0.9V/2.5V staggered (fail-safe digital, 5V input tolerant digital and regular analog) I/O library SRAM compilers
MPW block size	9 mm²
Mini@sic characteristics	Not supported

It is a well supported advanced node.

40nm CMOS Logic or MS/RF, Low Power
Technology characteristics	Shrink technology: YES (90% linear shrink) Core voltage: 1.1V I/O voltage: 2.5V (1.8V underdrive, 3.3V overdrive) Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Optional Deep N-Well <110> P- substrate wafer. Substrate resistivity 8-12ohm-cm Dual Gate Oxide (1 for core, 1 for IO) Vt options: lvt, svt, hvt, native Temperature range: -40C to 125C # of metals: 3 to 10 Cu + alrdl Interconnect dielectric: ELK Top metal: 3.1KA, 9KA, 12.5KA, 34KA CMP on STI, contact, metals, vias and passivation MoM Passivation: dual layers
Options that need special attention	OTP/MTP SRAM Cell
Wafer size	12 inch
Deliverables	# of dies (no wafer!): 100 dies / wafer
Design tools	PDK: Cadence CDBA and OA, TSMC iPDK, Mentor
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics, Synopsys, Magma, TSMC iDRC
Verification tools LVS	Cadence, Mentor Graphics, Synopsys, Magma, TSMC iLVS
Parasitic extraction tools	Cadence, Mentor Graphics, Synopsys
P&R tools	Cadence, Synopsys
Foundry IP	12-track / 9-track core cell libraries, multi-vt, coarse grain 1.1V/2.5V staggered (fail-safe digital, 5V input tolerant digital, hybrid small footprint digital/analog and regular analog) I/O library SRAM compilers
MPW block size	9 mm²
Mini@sic characteristics	Supported Min area: 3mm² (pre-shrink) mini@sic Technology options

The TSMC 28nm technology is the most performant planar mainstream solution that evolved through the years due to constant enhancements in the manufacturing process. It supports a wide range of applications, including CPUs, GPUs, high-speed networking chips, smart phones, APs, tablets, home entertainment, consumer electronics, automotive and IoT.

The 28nm RF (28HPC+ RF) technology also provides support for 110GHz mmWave and for 5G mmWave RF.

28nm CMOS HPC+ Logic, RF
Technology characteristics	Shrink technology: YES Core voltage: 0.9V I/O voltage: 1.8V Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Triple well, Deep N-Well in option Dual Gate Oxide Vt options: ulvt, lvt, svt, hvt, uhvt, ehvt 5V HVMOS HighRes resistors Temperature range: -40C to 125C # of metals: 5 to 10 Cu + ALRDL Interconnect dielectric: ELK Top metal: 8.5KA, 11.5KA, 35KA CMP on STI, contact, via and passivation MoM capacitor Passivation: dual layers
Options that need special attention	SRAM Cell Vt’s: maximum of 4 VT types in one design.
Wafer size	12 inch
Deliverables	100 dies, no wafer
Design tools	PDK: TSMC iPDK
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics, Synopsys
Verification tools LVS	Cadence, Mentor Graphics, Synopsys
Parasitic extraction tools	Cadence, Mentor Graphics, Synopsys
P&R tools	Cadence, Synopsys
Foundry IP	12-track / 9-track / 7-track core cell libraries, multi-vt’s 0.9V/1.8V hybrid staggered (fail-safe digital and regular analog) I/O library SRAM compilers by TSMC , ARM, Synopsys
MPW block size	6mm² (on silicon)
Mini@sic characteristics	Supported Min area: 1mm² (pre-shrink) mini@sic Technology options

The 28nm RF (28HPC+ RF) technology also provides support for 110GHz mmWave and for 5G mmWave RF.

28nm CMOS HPC Logic, RF
Technology characteristics	Shrink technology: YES Core voltage: 0.9V I/O voltage: 1.8V Shallow Trench Isolation (STI) Wells: Retrograde twin well for low well sheet resistance and better latch-up behavior. Triple well, Deep N-Well in option Dual Gate Oxide Vt options: ulvt, lvt, svt, hvt, uhvt, ehvt 5V HVMOS HighRes resistors Temperature range: -40C to 125C # of metals: 5 to 10 Cu + ALRDL Interconnect dielectric: ELK Top metal: 8.5KA, 11.5KA, 35KA CMP on STI, contact, via and passivation MoM capacitor Passivation: dual layers
Options that need special attention	SRAM Cell Vt’s: maximum of 4 VT types in one design.
Wafer size	12 inch
Deliverables	100 dies, no wafer
Design tools	PDK: TSMC iPDK
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics, Synopsys
Verification tools LVS	Cadence, Mentor Graphics, Synopsys
Parasitic extraction tools	Cadence, Mentor Graphics, Synopsys
P&R tools	Cadence, Synopsys
Foundry IP	12-track / 9-track / 7-track core cell libraries, multi-vt’s 0.9V/1.8V hybrid staggered (fail-safe digital and regular analog) I/O library SRAM compilers by TSMC , ARM, Synopsys
MPW block size	6mm² (on silicon)
Mini@sic characteristics	Supported Min area: 1mm² (pre-shrink) mini@sic Technology options

EUROPRACTICE has recently extended its portfolio by including a flagship technology TSMC 16nm CMOS logic FinFet Compact 0.8V/1.8V. It provides superior performance and power consumption advantage for next generation high-end mobile computing, network communication, consumer and automotive electronic applications.

Since it is classified as a leading node technology, access to it is subject to review and approval by TSMC.

16nm CMOS logic FinFet Compact
Technology characteristics	Shrink technology: 2% shrink Core voltage: 0.8V I/O voltage: 1.8V Shallow Trench Isolation (STI) Triple well, Deep N-Well in option Dual gate oxide Vt options: hvt, svt, lvt, ulvt, low noise vt 5V HVMOS TiN High Resistor N+/P+ metal gate allows symmetrical design of NMOS and PMOS devices Temperature range: -40C to 125C # of metals: 6 to 13 Cu plus last metal level in Al pad Interconnect dielectric: ELK HD MiM capacitors Passivation: dual layers 12 inch wafers
Wafer size	12 inch
Deliverables	100 dies, no wafer
Design tools	PDK: TSMC iPDK
Simulation tools	HSPICE, Eldo, Spectre
Verification tools DRC	Cadence, Mentor Graphics, Synopsys
Verification tools LVS	Cadence, Mentor Graphics, Synopsys
Parasitic extraction tools	Cadence, Mentor Graphics, Synopsys
P&R tools	Cadence, Synopsys
Foundry IP	9-track, 7.5-track body biased core cell libraries with gate lengths of 16, 20 and 24nm 0.8V/1.8V hybrid staggered I/O library SRAM compilers by TSMC, ARM_Artican, ARM ltd, GUC, Synopsys
MPW block size	4 mm²
Mini@sic characteristics	Not supported

Discover TSMC metal stacks options and mini@sic options available through EUROPRACTICE:

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